Side Contact Pogo Pins are designed with a bevel structure and built-in spring mechanism. They are mainly composed of three core components: Plunger, SolidPin, Spring and Body, and are assembled through precision molds and special equipment. The function of the bevel structure design is to ensure that when the Pogo Pins are working, the lateral force generated by the contact between the bevel and the spring is used to maintain a stable contact force between the needle and the inner wall of the needle tube, prompting the current path to mainly pass through the gold-plated needle (Plunger) and needle tube ( Body), resulting in stable and extremely low contact resistance, maintaining a stable and reliable connection even during frequent plugging and unplugging.
How to install Side Contact Pogo Pins:
SMT automatic patch reflow soldering technology: The SMT automatic patch machine automatically mounts Side Contact Pogo Pins onto the PCB circuit board with solder paste printed on it. The solder pins are accurately inserted into the PCB circuit board holes, and then the solder paste is melted through the reflow soldering process. And solidify to complete the fixed connection with the PCB pad. This process is fast, highly precise and highly automated, greatly improving production efficiency and product quality.
Side Contact Pogo Pin is a classification of Pogo Pin connector. It is a built-in spring connector designed and manufactured based on the bevel structure. It usually consists of three core parts: Plunger, SolidPin, Spring and Body. It is characterized by side contact type. Suitable for SMT automatic patch reflow soldering, high welding strength (stronger welding with PCB circuit board), low resistance, stable and reliable connection, long life, and more durable.
Side Contact Pogo Pin adopts Plunger bevel structure and Plunger inner hole bevel structure. Effectively ensure that lateral force is converted into contact force to ensure stable and reliable connection.
Contact force and contact resistance are the core factors for stable and reliable connections, and there is a direct relationship between contact force and contact resistance. Increasing contact force can effectively reduce contact resistance. Therefore, achieving stable contact force and contact resistance is key to establishing a reliable connection.
When the bevel and spring are working, the lateral force generated is converted into contact force, allowing the gold-plated needle to maintain stable contact with the inner wall of the needle tube, thereby obtaining stable and extremely low contact resistance, ensuring a stable and reliable connection.
Vacuum blind hole plating technology is known for its excellent performance and can accurately plate a layer of gold inside and outside extremely fine blind holes. This advanced electroplating process not only ensures the overall beauty of the metal surface, but also provides excellent corrosion and wear resistance. Every detail, whether inside or outside the hole, shows a golden and shiny color, and there will be no peeling or gold falling off problems. The precision and stability of this technology ensure the durability and durability of the electroplated layer, meeting a variety of demanding application requirements.
Mature design, high-precision processing and advanced vacuum blind hole plating technology are combined to achieve extremely low and stable contact resistance.
Material: | Main Technical Parameters: |
● Plunger: Lead-Free Copper Alloy | ● Standard state: |
● Body: Lead-Free Copper Alloy | ● Operating temperature: -40~+120°C(Standard) |
● Spring: Stainless Steel | ● Operating humidity: 20-85%RH |
● SolidPin: Lead-Free Copper Alloy | ● Storage temperature: -10~+50°C |
● Storage humidity: 20-85%RH | |
● Rating voltage: 36V AC/DC(Standard) | |
● Rating current: 2A/Pin Continuous(Standard) | |
● Contact resistance: 30 mΩ Max.(Standard) | |
● Withstanding voltage: 250V AC ,1 Minute | |
● Insulation resistance: 500 MΩ Min. | |
● Durability:10,000 Cycle(Standard) | |
● Working Spring Force:100~180gf(Standard) | |
Electroplating: | Contact Type: |
● Plunger: Ni Plating 1.4μm, Gold Plating 0.30μm | ● Vertical Contact Type |
● Body: Ni Plating 1.4μm, Gold Plating 0.10μm | |
● SolidPin: Ni Plating 1.4μm, Gold Plating 0.10μm | |
Installation Method: | Environmental Protection Standard : |
● SMT automatic placement machine+Reflow soldering | ● Comply with EU RoHS and Reach standards |
● Plugin machine + Wave soldering |
SN | Product Image | Full Stroke | Initial Height | Working Height | Catalog Download |
1 | 1.30~5.50 | 4.50~15.00 | 3.20~14.00 | 侧接触Pogo Pins |